FLIR BOSON 640 Radiometric, Industrial Grade 40mK, 9Hz

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FLIR BOSON, Apliter Termografia

FLIR BOSON 640 Radiometric

Consult price

Description

Thermal imaging camera core 

FLIR BOSON LWIR for integration

FLIR Boson® thermal imaging camera cores set a new standard for size, weight, power consumption and performance. Its uncooled vanadium oxide detector is available in various resolutions and lens configurations for maximum adaptability to your project. As a thermographic sensor for application development, the FLIR BOSON core uses standard interfaces and communication protocol, making it easy to integrate with any type of controller, computer or peripheral.

Revolutionary dimensions and performance

The FLIR BOSON core has a size, weight and power consumption never seen in high-performance thermographic sensors.

Powerful video and image processing on board 

The BOSON uses the FLIR XIR™ scalable infrared video processing architecture, allowing integrators to take advantage of advanced image processing and video analytics while maintaining low power consumption due to the ability to process video on the same FLIR BOSON Core.

FLIR-quality core at an affordable price

BOSON's new design achieves high resolution thermal imaging sensors for the price of a low resolution thermal imaging camera.

Boson 3.0 controller graphical user interface

The Boson GUI 3.0 graphical user interface gives developers the ability to quickly access and adjust critical radiometry parameters for high-speed integration cycles, balancing schedule, cost and performance. Optimize radiometric parameters using spot meters, regions of interest (ROI), isotherms and external synchronization capability during development testing and tuning.

Order No. 20640A012-9IAAX, 20640A018-9IAAX, 20640A024-9IAAX, 20640A032-9IAAX, 20640A050-9IAAX, 20640A006-9IAAX, 20640A008-9IAAX, 20640A095-9IAAX, 20640X000-9IAAX, 20640X000-9IAAX

Launch of FLIR Boson

Technical data

SPECIFICATIONS
GENERAL DESCRIPTION
Pixel pitch12 µm
Precision mounting holesFour M1.6 x 0.35 threaded holes (rear cover). Lens compatibility recommended when lens mass exceeds core mass.
Size21 × 21 × 11 mm without lens
Thermal sensitivity <40 mK
Weight7.5 g without lens (depending on configuration)
FOOD
Input voltage3,3 VCC
Power dissipationDepending on configuration; at least 500 mW
ELECTRICAL AND MECHANICAL
Control channelsUART or USB
Peripheral channelsI2C, SPI, SDIO
Video channelsCMOS or USB2
IMAGING AND OPTICS
Continuous electronic zoomZoom from 1X to 8X
Number F1
Image orientationAdjustable (vertical rotation and/or horizontal rotation)
Non-uniformity correction (NUC)Factory calibrated; FFC (flat field corrections) updated with FLIR Silent Shutterless NUC (SSN™)
Sensor technologyUncooled VOx microbolometer
Slow frame rate≤9 Hz available
SnapshotsFull image snapshot, SDIO interface for removable media compatibility
Sun protectionIntegral
Spectral rangeLongwave infrared; 7.5 µm - 13.5 µm
Symbol overlayEach frame rewritable; alpha blending for translucent overlay
Scene dynamic range [gain mode in parentheses].Up to +140 °C (high); up to +500 °C (low)
ENVIRONMENTAL AND APPROVALS
Non-operating temperature rangeFrom -50 to 105 °C
Operating temperature rangeFrom -40 to 80 °C
Operating altitude12 km (max. altitude of a commercial aircraft or an aerial platform)
Hits1500 g at 0.4 ms

Box contents

  • FLIR Boson 640, Industrial Grade 40mK, 9Hz Thermal Imaging Camera Core

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